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High speed digital isolators Broadcom HCPL-0900-500 offering low propagation delay skew and galvanic isolation

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High speed digital isolators Broadcom HCPL-0900-500 offering low propagation delay skew and galvanic isolation

CMTI(kV/us) : 18kV/us

Default Output : -

Number of Forward Channels : 1

Operating Temperature : -40℃~+100℃

Description : SOIC-8 Digital Isolators

Mfr. Part # : HCPL-0900-500

Model Number : HCPL-0900-500

Package : SOIC-8

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Broadcom HCPL-90xx and HCPL-09xx High-Speed Digital Isolators

Product Overview

The Broadcom HCPL-90xx and HCPL-09xx series are high-speed CMOS digital isolators featuring excellent transient immunity and industry-leading performance. With a typical pulse width distortion of 2 ns and propagation delay skew of 4 ns, these devices offer a 100 Mbaud data rate, making them the fastest digital isolators available. They provide reliable galvanic isolation and are suitable for a wide range of applications including digital fieldbus isolation, multiplexed data transmission, computer peripheral interfaces, high-speed digital systems, isolated data interfaces, and logic level shifting. Available in various channel configurations and package types, they operate across a wide temperature range of -40C to +100C.

Product Attributes

  • Brand: Broadcom
  • Technology: CMOS Digital Isolators
  • Certifications: UL1577, IEC 61010-1
  • ESD Sensitivity: Requires normal static precautions
  • Not for: or aerospace applications

Technical Specifications

Model/Series Channels Package Type Data Rate Pulse Width Distortion (Typ.) Propagation Delay Skew (Typ.) Isolation Voltage (RMS) Operating Temperature Supply Voltage (VDD1, VDD2)
HCPL-90xx / HCPL-09xx Single, Dual, Quad 8-pin PDIP, 8-pin Gull Wing, 8-pin SOIC, 16-pin SOIC Narrow Body, 16-pin SOIC Wide Body 100 Mbaud 2 ns 4 ns 2500V -40C to +100C +3.3V, +5V
Features
  • +3.3V and +5V TTL/CMOS compatible
  • 3 ns max. pulse width distortion
  • 6 ns max. propagation delay skew
  • 15 ns max. propagation delay
  • 15 kV/s min. common mode rejection
  • Tri-state output (HCPL-9000/-0900)
Applications
  • Digital fieldbus isolation
  • Multiplexed data transmission
  • Computer peripheral interface
  • High-speed digital systems
  • Isolated data interfaces
  • Logic level shifting
Specific Model Configurations Channel Configuration Package Ordering Information Example
HCPL-9000/-0900 Single 8-pin DIP (300 Mil) / 8-pin SOIC HCPL-9031-500E (300-mil DIP Gull Wing Surface-Mount package in Tape and Reel, RoHS compliant)
HCPL-9030/-0930 Dual 8-pin DIP (300 Mil) / 8-pin SOIC
HCPL-9031/-0931 Dual, Bidirectional 8-pin DIP (300 Mil) / 8-pin SOIC
HCPL-900J/-090J Quad 16-pin SOIC Wide Body / 16-pin SOIC Narrow Body
HCPL-901J/-091J Quad, 2/2, Bidirectional 16-pin SOIC Wide Body / 16-pin SOIC Narrow Body
HCPL-902J/-092J Quad, 1/3, Bidirectional 16-pin SOIC Wide Body / 16-pin SOIC Narrow Body
Electrical Specifications (Typical at 3.3V Operation) Parameter Symbol Min. Typ. Max. Unit Test Conditions
Quiescent Supply Current 1 IDD1 - - 0.008 - 0.018 mA VIN = 0V
Quiescent Supply Current 2 IDD2 - - 1.5 - 12.0 mA VIN = 0V
Logic Input Current IIN -10 - 10 A
Logic High Output Voltage VOH 0.8 * VDD2 - VDD2 V IOUT = 20 A, VIN = VIH
Logic Low Output Voltage VOL - 0 0.1 - 0.8 V IOUT = 20 A, VIN = VIL
Maximum Data Rate - 100 110 - MBd CL = 15 pF
Propagation Delay Time to Logic Low Output tPHL - 10 - 12 15 - 18 ns
Propagation Delay Time to Logic High Output tPLH - 10 - 12 15 - 18 ns
Pulse Width Distortion |PWD| - 2 3 ns
Propagation Delay Skew tPSK - 4 6 ns
Output Rise Time (10% to 90%) tR - 1 - 2 3 - 4 ns
Output Fall Time (10% to 90%) tF - 1 - 2 3 - 4 ns
Channel-to-Channel Skew (Dual and Quad Channels) tCSK - 2 3 ns
Common Mode Transient Immunity |CMH|, |CML| 15 18 - kV/s Vcm = 1000V
Insulation Characteristics Parameter Symbol Min. Typ. Max. Unit Test Conditions
Barrier Resistance - - >1014 - -
Barrier Capacitance - - - 3 - 7 - pF f = 1 MHz
Creepage Distance (External) - - 4.03 - 8.08 - - mm
Leakage Current - - - 0.2 - A 240 Vrms, 60 Hz

2411271956_Broadcom-HCPL-0900-500_C7201470.pdf


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