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Digital Isolation Solutions Including Broadcom HCPL 902J 500E for Peripheral Interface Applications

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Digital Isolation Solutions Including Broadcom HCPL 902J 500E for Peripheral Interface Applications

CMTI(kV/us) : 18kV/us

Default Output : -

Number of Forward Channels : 3

Number of Reverse Channels : 1

Operating Temperature : -40℃~+100℃

Description : SOIC-16-300mil Digital Isolators RoHS

Mfr. Part # : HCPL-902J-500E

Model Number : HCPL-902J-500E

Package : SOIC-16-300mil

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Broadcom HCPL-90xx / HCPL-09xx High-Speed Digital Isolators

Product Overview

The Broadcom HCPL-90xx and HCPL-09xx series are high-speed CMOS digital isolators designed for robust performance and excellent transient immunity. Featuring a symmetric magnetic coupling barrier, these isolators offer industry-leading speed with a typical pulse width distortion of 2 ns, a typical propagation delay skew of 4 ns, and a data rate of 100 Mbaud. Available in various channel configurations (single, dual, and quad) and package types, they are ideal for isolating data conversion devices, parallel buses, peripheral interfaces, and digital fieldbus applications. They operate across a wide temperature range of 40C to +100C.

Product Attributes

Brand: Broadcom
Technology: CMOS Digital Isolators
Certifications: UL1577, IEC 61010-1

Technical Specifications

Model Series	Channel Configuration	Package Type	Data Rate	Pulse Width Distortion (Typ.)	Propagation Delay Skew (Typ.)	Isolation Voltage (RMS)	Operating Temperature
HCPL-90xx / HCPL-09xx	Single	8-pin PDIP (300 Mil), 8-pin SOIC	100 Mbaud	2 ns	4 ns	2500V	-40C to +100C
HCPL-90xx / HCPL-09xx	Dual (Unidirectional)	8-pin DIP (300 Mil), 8-pin SOIC	100 Mbaud	2 ns	4 ns	2500V	-40C to +100C
HCPL-90xx / HCPL-09xx	Dual (Bidirectional)	8-pin DIP (300 Mil), 8-pin SOIC	100 Mbaud	2 ns	4 ns	2500V	-40C to +100C
HCPL-90xx / HCPL-09xx	Quad (Unidirectional)	16-pin SOIC Wide Body, 16-pin SOIC Narrow Body	100 Mbaud	2 ns	4 ns	2500V	-40C to +100C
HCPL-90xx / HCPL-09xx	Quad (2 channels one direction, 2 opposite)	16-pin SOIC Wide Body, 16-pin SOIC Narrow Body	100 Mbaud	2 ns	4 ns	2500V	-40C to +100C
HCPL-90xx / HCPL-09xx	Quad (1 channel one direction, 3 opposite)	16-pin SOIC Wide Body, 16-pin SOIC Narrow Body	100 Mbaud	2 ns	4 ns	2500V	-40C to +100C

Key Features

+3.3V and +5V TTL/CMOS compatible
3 ns max. pulse width distortion
6 ns max. propagation delay skew
15 ns max. propagation delay
High speed: 100 MBd
15 kV/s min. common mode rejection
Tri-state output (HCPL-9000/-0900)
2500V RMS isolation

Applications

Digital fieldbus isolation
Multiplexed data transmission
Computer peripheral interface
High-speed digital systems
Isolated data interfaces
Logic level shifting

Electrical Specifications (Typical @ +25C, VDD1 = VDD2 = +3.3V)

Parameter	Symbol	Min.	Typ.	Max.	Unit	Test Conditions
Quiescent Supply Current 1	IDD1	-	0.008 (HCPL-9000/-0900)	0.01 (HCPL-9000/-0900)	mA	VIN = 0V
Quiescent Supply Current 2	IDD2	-	3.3 (HCPL-9000/-0900)	4.0 (HCPL-9000/-0900)	mA	VIN = 0V
Logic Input Current	IIN	-10	-	10	A	-
Logic High Output Voltage	VOH	VDD2 0.1	-	VDD2	V	IOUT = 20 A, VIN = VIH
Logic Low Output Voltage	VOL	-	0	0.1	V	IOUT = 20 A, VIN = VIL

Switching Specifications (Typical @ +25C, VDD1 = VDD2 = +3.3V)

Parameter	Symbol	Min.	Typ.	Max.	Unit	Test Conditions
Maximum Data Rate	-	100	110	-	MBd	CL = 15 pF
Propagation Delay Time to Logic Low Output	tPHL	-	12	18	ns	-
Propagation Delay Time to Logic High Output	tPLH	-	12	18	ns	-
Pulse Width Distortion	\|PWD\|	-	2	3	ns	\|tPHL tPLH\|
Propagation Delay Skew	tPSK	-	4	6	ns	-
Common Mode Transient Immunity	\|CMH\|, \|CML\|	15	18	-	kV/s	Vcm = 1000V

Package Characteristics

Parameter	Symbol	Min.	Typ.	Max.	Unit	Test Conditions
Capacitance (Input-Output)	CI-O	-	1.1 (Single Channel)	-	pF	f = 1 MHz
Barrier Resistance \|\| Capacitance	-	>10¹⁴	3	-	\|\| pF	-
Creepage Distance (External)	-	4.03 (16-Pin SOIC Narrow)	-	-	mm	-
Leakage Current	-	-	0.2	-	A	240 Vrms, 60 Hz

Package Outline Drawings

Refer to the datasheet for detailed package outline drawings for 8-pin PDIP, 8-pin Gull Wing, 8-pin SOIC, and 16-pin SOIC (narrow and wide body) packages.

Handling Precautions

Take normal static precautions in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. The components featured in this data sheet are not to be used in or aerospace applications or environments.

2411271956_Broadcom-HCPL-902J-500E_C6873793.pdf

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